Innovations in Thermal Design for Future Power Electronics: Seminar at IEE SAS Unveils New Collaboration Opportunities

On February 19, 2025, the Institute of Electrical Engineering of the Slovak Academy of Sciences (IEE SAS) hosted the seminar “Innovations in Thermal Management for Modern Power Electronics,” co-organized with TechSim, the leading SIEMENS partner in CEE. The event aimed to present the latest technologies and approaches in thermal management for power modules and to foster the exchange of knowledge between academic and industrial experts.

The seminar brought together representatives from leading companies, including Semikron-Danfoss, Delta Electronics, EVPÚ, Powertec, and Siemens, as well as academic partners from the Faculty of Electrical Engineering and Information Technology STU (FEI STU) and the Technical University of Košice (TUKE). This diverse participation highlighted the importance of connecting science and industry to drive innovative solutions in power electronics.

The program featured several expert presentations. Representatives from TechSim and Siemens – Mike Fletcher, David Tompa, and Juraj Čechovič – discussed the application of Power Cycling Testing (PCT) in designing modern electronic systems. They provided a detailed overview of the Siemens PCT system and its practical use on the equipment installed at IEE SAS, along with advanced thermal simulations for modelling heat dissipation in power modules.

An important part of the event were the presentations by representatives from IEE SAS (M. Ťapajna) and FEI STU (Assoc. Prof. J. Marek, PhD.), who showcased the ongoing trilateral SK-TW project in collaboration with Taiwan’s ITRI. This project focuses on building-up educational laboratories for assembling, diagnostics, and reliability testing of the power modules for electromobility. They also presented opportunities for collaboration with the R&D teams of the participating industry partners, paving the way for new innovative projects.

The seminar proved to be an excellent platform for exchanging knowledge and experiences between academia and industry. Discussions during the event laid the foundation for future collaborations and the development of new solutions in thermal management for power modules – a critical area for advancing electronics and electromobility.

This seminar once again demonstrated that connecting science and industry leads to innovations that shape the future of power electronics.